Scanning Acoustic Microscope Sam
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SAM Ultrasonic Testing Equipment
Scanning Acoustic Microscope Sam
| Test items | Sample style | Automotive IGBT module |
| Test range | Sample chip packaging range, 63mm x 73.25mm | |
| items | 1. Internal defects 2. Pin interface |
|
| Optical format | Test method | Ultrasonic scanning imaging, KSI V450E, dual probe |
| Probe frequency | 10MHz / 50MHz | |
| Image accuracy | Up to 32,000 x 32,000 pixel | |
| Equipment specifications | Equipment size | 6951(length) x 2560(width) x 1578(height) |
| Feeding method | Trolley (Magazine type) feeding [1 car 10 trays (Carrier), 1 tray 10 pieces (pcs)] |
|
| Discharging method | Trolley (Magazine type) discharging [1 car 10 trays (Carrier), 1 tray 10 pieces (pcs)] |
|
| Operation mode | Except for manual pushing and unloading of the trolley, the rest is fully automatic, and has the function of isolating and placing NG products | |
| Control method | PLC+PC | |
| Power supply specifications | Group 1: 220VAC/150A/three-phase supply to the automatic conveying system Group 2: 220VAC/30A/single-phase supply to the ultrasonic host |
|
| Air pressure specifications | 560 Liter/min, 0.6-0.8Mpa | |
| Pure water requirements | 10 Liter/min，0.2-0.3Mpa |
【Features】
• Ultrasonic scanning
• Image accuracy 32.000px
• Dual probe
• Plastic package integrated circuit (IC)
• High power insulated gate bipolar transistor (IGBT) module
• Various types of capacitors
• Equipment with copper substrate
• Silicon carbide (SiC) ingots and substrates
【Product Description】
By integrating the ultrasonic fully automatic module, the system improves inspection efficiency, reduces human errors, and ensures overall quality consistency. This comprehensive approach brings significant benefits and provides advanced and reliable solutions for various inspection needs.
• Ultrasonic scanning
• Image accuracy 32.000px
• Dual probe
• Plastic package integrated circuit (IC)
• High power insulated gate bipolar transistor (IGBT) module
• Various types of capacitors
• Equipment with copper substrate
• Silicon carbide (SiC) ingots and substrates
【Product Description】
By integrating the ultrasonic fully automatic module, the system improves inspection efficiency, reduces human errors, and ensures overall quality consistency. This comprehensive approach brings significant benefits and provides advanced and reliable solutions for various inspection needs.